NEWARK, Del, July 08, 2022 (GLOBE NEWSWIRE) — The global semiconductor packaging market is expected to reach US$ 26.9 Bn in 2022. Sales are projected to increase at a 6.5% CAGR over the assessment period, with the market valuation reaching US$ 50.6 Bn by 2032.
Semiconductor packaging is widely used in electronic devices as it plays the role of mediator between substances. Semiconductor packaging performs a crucial function in defensive IC chips as it encircles the surroundings and makes sure that the chip is mount on revealed wiring boards.
Rising demand for innovative digital gadgets such as smartphones, tablets, and wearables will spur demand for semiconductor packaging. In addition to this, increasing integration of semiconductors in autonomous and electric vehicles will continue boosting sales in the automotive sector over the forecast period.
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Semiconductor packaging is widely used in the aerospace and defence industry as well. It is used for data processing units and aircraft guidance control assemblies in the aerospace industry.
The defence sector uses semiconductor chips for the missile defence system. Also, advanced fighter planes require a high amount of semiconductor packaging in them. The aviation industry is also utilising semiconductors for applications in boarding, checking, and immigration. This is anticipated to augment the sales of semiconductor packaging over the forecast period.
“Increasing demand for plastic semiconductor packaging, along with expansion in the electronics sector across emerging economies will fuel the growth in the market over the forecast period,” says an FMI analyst.
- Based on material type, sales in the plastic segment will account for 42% of the total market share in 2022.
- In terms of end use industry, the consumer electronics segment will offer an incremental opportunity of around US$ 12.1 Bn.
- The U.S. is expected to account for 16% of the North America semiconductor packaging market share by 2032.
- The India semiconductor packaging market will offer an incremental opportunity of more than US$ 1.7 Bn.
Amkor Technology, ASE Group, Intel Corporation, Samsung Electronics Co., Ltd., Texas Instruments, Fujitsu Limited, and Powertech Technology, Inc. are the key players operating in the semiconductor packaging market. Some of the other noticeable players in the global semiconductor packaging market include Taiwan Semiconductor Manufacturing Company, FlipChip International LLC, HANA Micron Inc., ISI – Interconnect Systems, Veeco Instruments Inc, Signetics, Broadcom Inc., and STMicroelectronics NV are some of the leading players operating in the global semiconductor packaging market. The key players in tier 1 hold around 20-25% of the global semiconductor packaging market.
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Semiconductor Packaging Market Report
Future Market Insights, in its new report, offers an unbiased analysis of the global semiconductor packaging market, analyzing historical demand from 2015-2021 and forecast statistics for 2022-2032. The study reveals market growth projections for the semiconductor packaging based on the material (plastic, ceramic and metal), technology (grid-array, small outline packaging, flat no-leads package, and dual in-line packaging), and end use industry (consumer electronics, automotive, healthcare, IT & telecommunication, aerospace & defense) across seven regions.
Semiconductor Packaging Market by Category
- Small Outline Packaging
- Flat No-leads Package
- Dual In-line Packaging
By End Use Industry:
- Consumer Electronics
- IT & Telecommunication
Aerospace & Defence
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About the Packaging Division at Future Market Insights
The packaging division at Future Market Insights provides an in-depth historical analysis and projections for the next ten years and covers the competitive landscape through a unique dashboard view. Ranging from packaging materials, packaging machinery to packaging designs & formats, Future Market Insights has an exhaustive database for these industry verticals, serving clients with unique research offerings and strategic recommendations. With a repository of 1,000+ reports, the team has analysed the packaging industry comprehensively in 50+ countries. The team evaluates every node of the value chain and provides end-to-end research and consulting services; reach out to explore how we can help.
Table of Content
1. Executive Summary
1.1. Global Market Outlook
1.2. Demand-side Trends
1.3. Supply-side Trends
1.4. Technology Roadmap Analysis
1.5. Analysis and Recommendations
2. Market Overview
2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations
3. Market Background
3.1. Market Dynamics
3.2. Impact of Covid-19
3.3. Macro Factors and Forecast Factors
3.4. Value Chain Analysis
4. Global Semiconductor Packaging Market Analysis 2015-2021 and Forecast, 2022-2032
4.1. Historical Market Size Value (US$ Bn) & Volume (Units) Analysis, 2015-2021
4.2. Current and Future Market Size Value (US$ Bn) & Volume (Units) Projections, 2022-2032
Click Here for Semiconductor Packaging Market 225 pages TOC Report
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